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PD-600Q
PUDIVAC
Pudi Vacuum offers three RF plasma cleaning systems, designed to accommodate different sample sizes for versatile applications in semiconductors, optics, medical devices, and material science.
PD-150Q
Max Sample Size: 120 × 120 mm
Ideal for: Small-scale R&D, precision components, and lab testing.
PD-300Q
Max Sample Size: 260 × 260 mm
Ideal for: Medium-sized substrates, industrial prototyping, and batch processing.
PD-600Q
Max Sample Size: 500 × 500 mm
Ideal for: Large panels, production-scale cleaning, and high-throughput applications.
RF Frequency: 13.56 MHz (industry-standard) for stable plasma generation.
Multi-gas Compatibility: Supports O₂, Ar, N₂, CF₄, and other process gases.
Uniform Cleaning: Optimized electrode design for consistent surface treatment.
User-Friendly Interface: Programmable controls for power, time, and gas flow.
Decontamination of organic residues, oxide removal, and surface activation.
Suitable for wafers, glass, metals, polymers, and 3D-structured components.
✔ Scalability – From R&D to full production.
✔ Reliability – Robust vacuum and RF systems for long-term performance.
✔ Customization – Optional upgrades (ICP source, automation integration).
For technical specifications or a tailored solution, feel free to contact us by
Pudi Vacuum offers three RF plasma cleaning systems, designed to accommodate different sample sizes for versatile applications in semiconductors, optics, medical devices, and material science.
PD-150Q
Max Sample Size: 120 × 120 mm
Ideal for: Small-scale R&D, precision components, and lab testing.
PD-300Q
Max Sample Size: 260 × 260 mm
Ideal for: Medium-sized substrates, industrial prototyping, and batch processing.
PD-600Q
Max Sample Size: 500 × 500 mm
Ideal for: Large panels, production-scale cleaning, and high-throughput applications.
RF Frequency: 13.56 MHz (industry-standard) for stable plasma generation.
Multi-gas Compatibility: Supports O₂, Ar, N₂, CF₄, and other process gases.
Uniform Cleaning: Optimized electrode design for consistent surface treatment.
User-Friendly Interface: Programmable controls for power, time, and gas flow.
Decontamination of organic residues, oxide removal, and surface activation.
Suitable for wafers, glass, metals, polymers, and 3D-structured components.
✔ Scalability – From R&D to full production.
✔ Reliability – Robust vacuum and RF systems for long-term performance.
✔ Customization – Optional upgrades (ICP source, automation integration).
For technical specifications or a tailored solution, feel free to contact us by