The system PD-400C series magnetron sputtering coating equipment is equipped with a number of circular plane targets or rectangular plane targets, using DC, DC pulse, RF power supply.
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PD-400C
PUDI
8419899090-9
Wuhan Pudi Vacuum Technology Co., Ltd is a professional designer and manufacturer of high-quality tailor-made thin film deposition Systems,core team with 22 years of experience in in the fields of machinery, electronics, materials, vacuum, etc. Our research and development team,mainly from academic scientists and qualified engineers,helpfully supports and advises customers in choosing the proper system for their speical needs,equipment installation and training,and steady and fast after-sales services.
For Magnetrn Sputtering Coater,the typical models including:
Model | PD-200C | PD-300C | PD-400C | PD-500C | PD-600C | PD-450CS | PD-550CS |
Application | Widely used in scientific research institutes and laboratories to prepare metal electrode layers, sample preparation for scanning electron microscopy, and research on new organic materials and new processes related to new energy materials. It is used in the research and development of perovskite solar cells, OLED, lithium batteries, quantum dot LED, OPV and other industries, and can prepare ITO oxide, nitride, metal and other thin film materials. At the same time, it is also suitable for multi-material research such as metals, semiconductors, nanotechnology and insulators. | ||||||
Materials | Metal materials such as aluminum, titanium, zirconium, chromium, nickel, iron, etc. Oxide materials such as alumina, silicon oxide, titanium oxide Semiconductor materials: such as silicon, germanium, etc. | ||||||
Device Size (L×W×H) | 500×500×600mm | 550×900×1850mm | 850×1500×1900mm | 1450×1250×1850mm | 2200×1700×2200mm | 1500×850×1900mm | 1500×850×1900mm |
chamber Size(L×W×H) | Φ220×H340mm Cylindrical | 300×300×380mm | 400×400×380mm | 500×500×500mm | 600×600×500mm | 440×440×450mm | 500×440×450mm |
Ultimate Vacuum | 6×10-5Pa | 7×10-5Pa | 3×10-5Pa | 3×10-5Pa | 3×10-7Pa | 5×10-5Pa | 5×10-5Pa |
Pumping speed | 6×10-4Pa≤20min | 8×10-4Pa≤35min | 8×10-4Pa≤30min | 8×10-4Pa≤35min | 5×10-6Pa≤30min | 9×10-4Pa≤35min | 9×10-4Pa≤35min |
Keep pressure | 12H≤8pa | 12H≤8pa | 12H≤8pa | 12H≤5pa | 12H≤5pa | 12H≤5pa | 12H≤5pa |
Unifimity | Better than ±5% | ||||||
Sputter target gun | 2-3inch target gun 1pc | 2-3inch target gun 2pcs | 2-3inch target gun 3pcs | 2-3 inch target gun 4pcs | 2-3 inch target gun 4pcs | Rectangular targets L365mm x W75mm 2pcs | Rectangular targets L450mm x W75mm 2pcs |
Substrate Size | 2-3INCH | 2-4INCH | 2-4INCH | 2-6INCH | 2-6INCH | 200×200mm | 250×250mm |
Control system | Siemens PLC + PC automatic control; the speed and final thickness can be input, and PID adjustment automatically controls the evaporation power output. |
More About PUDI VACUUM PD-400C
PD-400C series magnetron sputtering coating equipment is equipped with a number of circular plane targets or rectangular plane targets, using DC, DC pulse, RF power supply, the series of equipment vacuum mechronics design covers a small area (width 650* depth 1100mm), high degree of automation; The core components are imported and assembled domestically, with high cost performance; Modular design, scalability and high reliability; Widely used in research institutes, laboratories to prepare single-layer or multi-layer films, as well as new materials, new technology research.
Features
★ Front door sputtering chamber;
★ Domestic molecular pump and direct-linked rotary vane pump, optional imported molecular pump and dry pump system;
★ 3 magnetic target positions, magnetic target specifications are 50mm,
75mm optional, choose European and American famous brands;
★ Compatible with DC and RF sputtering sources, sputtering metal, non-metal and compound films (such as: ITO), etc.
★ Up or down sputtering;
★ 2-4 inch substrate/or custom substrate table according to customer specified substrate, substrate rotation, can be biased; Substrate heating 500 °C ;
★ 2 ~ 4 channel process gas;
★ Good film uniformity and repeatability, can deposit metal, semiconductor and insulating materials, can be expanded to deposit multilayer film and composite film.
Technical Specification
Vacuum Chamber | Φ 400 x H350mm; 304 stainless steel vacuum chamber with mirror-polished inner surface |
Vacuum System | Domestic molecular pump + joint venture mechanical pump or imported molecular pump + imported mechanical pump/dry pump |
Ultimate Vacuum | Better than 5.0×10-5Pa |
Restore vacuum time | Reach 9×10-4Pa≤20min |
Sputtering Target | 2 2-inch sputtering targets; 3 2-inch sputtering targets; 2 3-inch sputtering targets; 3 3-inch sputtering targets or 2 rectangular flat targets in many combinations |
Sputtering power supply | DC,DC pulse ,RF |
Substrate station | 2-4 inch substrate/or custom substrate table according to customer specified substrate, substrate rotation, can be biased; Substrate heating 500 ℃; |
Process gas | 2 ~ 4 process gas, can be expanded |
Uneven film thickness | ±3% to ±5% |
Electronic control system | Can realize full automatic control, programmable controller (PLC), LCD display touch screen |
Optional | Cooling circulating water dispenser/film thickness monitor/substrate table heating or water cooling/Sputtering power supply/bias power supply/constant voltage control system |
Manufacturer | PUDI VACUUM |
Contact Us
Manufacturer Full Name | WUHAN PUDI VACUUM TECHNOLOGY CO.,LTD |
Organisational Credit Number | VA91420100MA4KN2CF2B |
Email: | helen@pdvacuum.com ; zyw@pdvacuum.com |
Tel: | 0086 27 81293223 |
WECHAT/WHATSAPP: | 0086 13129990512 |
Wuhan Pudi Vacuum Technology Co., Ltd is a professional designer and manufacturer of high-quality tailor-made thin film deposition Systems,core team with 22 years of experience in in the fields of machinery, electronics, materials, vacuum, etc. Our research and development team,mainly from academic scientists and qualified engineers,helpfully supports and advises customers in choosing the proper system for their speical needs,equipment installation and training,and steady and fast after-sales services.
For Magnetrn Sputtering Coater,the typical models including:
Model | PD-200C | PD-300C | PD-400C | PD-500C | PD-600C | PD-450CS | PD-550CS |
Application | Widely used in scientific research institutes and laboratories to prepare metal electrode layers, sample preparation for scanning electron microscopy, and research on new organic materials and new processes related to new energy materials. It is used in the research and development of perovskite solar cells, OLED, lithium batteries, quantum dot LED, OPV and other industries, and can prepare ITO oxide, nitride, metal and other thin film materials. At the same time, it is also suitable for multi-material research such as metals, semiconductors, nanotechnology and insulators. | ||||||
Materials | Metal materials such as aluminum, titanium, zirconium, chromium, nickel, iron, etc. Oxide materials such as alumina, silicon oxide, titanium oxide Semiconductor materials: such as silicon, germanium, etc. | ||||||
Device Size (L×W×H) | 500×500×600mm | 550×900×1850mm | 850×1500×1900mm | 1450×1250×1850mm | 2200×1700×2200mm | 1500×850×1900mm | 1500×850×1900mm |
chamber Size(L×W×H) | Φ220×H340mm Cylindrical | 300×300×380mm | 400×400×380mm | 500×500×500mm | 600×600×500mm | 440×440×450mm | 500×440×450mm |
Ultimate Vacuum | 6×10-5Pa | 7×10-5Pa | 3×10-5Pa | 3×10-5Pa | 3×10-7Pa | 5×10-5Pa | 5×10-5Pa |
Pumping speed | 6×10-4Pa≤20min | 8×10-4Pa≤35min | 8×10-4Pa≤30min | 8×10-4Pa≤35min | 5×10-6Pa≤30min | 9×10-4Pa≤35min | 9×10-4Pa≤35min |
Keep pressure | 12H≤8pa | 12H≤8pa | 12H≤8pa | 12H≤5pa | 12H≤5pa | 12H≤5pa | 12H≤5pa |
Unifimity | Better than ±5% | ||||||
Sputter target gun | 2-3inch target gun 1pc | 2-3inch target gun 2pcs | 2-3inch target gun 3pcs | 2-3 inch target gun 4pcs | 2-3 inch target gun 4pcs | Rectangular targets L365mm x W75mm 2pcs | Rectangular targets L450mm x W75mm 2pcs |
Substrate Size | 2-3INCH | 2-4INCH | 2-4INCH | 2-6INCH | 2-6INCH | 200×200mm | 250×250mm |
Control system | Siemens PLC + PC automatic control; the speed and final thickness can be input, and PID adjustment automatically controls the evaporation power output. |
More About PUDI VACUUM PD-400C
PD-400C series magnetron sputtering coating equipment is equipped with a number of circular plane targets or rectangular plane targets, using DC, DC pulse, RF power supply, the series of equipment vacuum mechronics design covers a small area (width 650* depth 1100mm), high degree of automation; The core components are imported and assembled domestically, with high cost performance; Modular design, scalability and high reliability; Widely used in research institutes, laboratories to prepare single-layer or multi-layer films, as well as new materials, new technology research.
Features
★ Front door sputtering chamber;
★ Domestic molecular pump and direct-linked rotary vane pump, optional imported molecular pump and dry pump system;
★ 3 magnetic target positions, magnetic target specifications are 50mm,
75mm optional, choose European and American famous brands;
★ Compatible with DC and RF sputtering sources, sputtering metal, non-metal and compound films (such as: ITO), etc.
★ Up or down sputtering;
★ 2-4 inch substrate/or custom substrate table according to customer specified substrate, substrate rotation, can be biased; Substrate heating 500 °C ;
★ 2 ~ 4 channel process gas;
★ Good film uniformity and repeatability, can deposit metal, semiconductor and insulating materials, can be expanded to deposit multilayer film and composite film.
Technical Specification
Vacuum Chamber | Φ 400 x H350mm; 304 stainless steel vacuum chamber with mirror-polished inner surface |
Vacuum System | Domestic molecular pump + joint venture mechanical pump or imported molecular pump + imported mechanical pump/dry pump |
Ultimate Vacuum | Better than 5.0×10-5Pa |
Restore vacuum time | Reach 9×10-4Pa≤20min |
Sputtering Target | 2 2-inch sputtering targets; 3 2-inch sputtering targets; 2 3-inch sputtering targets; 3 3-inch sputtering targets or 2 rectangular flat targets in many combinations |
Sputtering power supply | DC,DC pulse ,RF |
Substrate station | 2-4 inch substrate/or custom substrate table according to customer specified substrate, substrate rotation, can be biased; Substrate heating 500 ℃; |
Process gas | 2 ~ 4 process gas, can be expanded |
Uneven film thickness | ±3% to ±5% |
Electronic control system | Can realize full automatic control, programmable controller (PLC), LCD display touch screen |
Optional | Cooling circulating water dispenser/film thickness monitor/substrate table heating or water cooling/Sputtering power supply/bias power supply/constant voltage control system |
Manufacturer | PUDI VACUUM |
Contact Us
Manufacturer Full Name | WUHAN PUDI VACUUM TECHNOLOGY CO.,LTD |
Organisational Credit Number | VA91420100MA4KN2CF2B |
Email: | helen@pdvacuum.com ; zyw@pdvacuum.com |
Tel: | 0086 27 81293223 |
WECHAT/WHATSAPP: | 0086 13129990512 |